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Introduction:
The rapid advancement of electronic devices has led to increased power densities, posing significant challenges for thermal management. The use of phase change materials (PCMs) has shown promise in effectively absorbing and dissipating heat in electronic systems. Computational modeling plays a crucial role in understanding and optimizing the heat transfer process in PCMs for thermal management applications. This thesis aims to investigate the computational modeling of heat transfer in a phase change material for thermal management of electronics.
Table of Contents:
Chapter 1: Introduction
1.1 Introduction
1.2 Background of Study
1.3 Problem Statement
1.4 Objective of Study
1.5 Limitation of Study
1.6 Scope of Study
1.7 Significance of Study
1.8 Structure of the Thesis
1.9 Definition of Terms
Chapter 2: Literature Review
2.1 Overview of Thermal Management in Electronics
2.2 Phase Change Materials in Thermal Management
2.3 Computational Modeling Techniques
2.4 Heat Transfer in Phase Change Materials
2.5 Previous Studies on Computational Modeling of Heat Transfer in PCMs
2.6 Challenges in Modeling Heat Transfer in PCMs
2.7 Future Trends in Thermal Management of Electronics
2.8 Comparison of Different PCM Materials
2.9 Experimental Validation of Computational Models
2.10 Summary of Literature Review
Chapter 3: Research Methodology
3.1 Research Design
3.2 Selection of PCM Material
3.3 Computational Modeling Approach
3.4 Boundary Conditions and Assumptions
3.5 Validation of Computational Models
3.6 Simulation Tools and Software
3.7 Data Analysis Techniques
3.8 Ethical Considerations
Chapter 4: Discussion of Findings
4.1 Analysis of Heat Transfer in PCM
4.2 Impact of PCM Properties on Thermal Management
4.3 Comparison of Different Modeling Approaches
4.4 Validation of Computational Models
4.5 Optimization of Thermal Management System
4.6 Discussion on Future Research Directions
4.7 Implications for Electronic Device Design
4.8 Practical Applications of Research Findings
Chapter 5: Conclusion and Summary
5.1 Summary of Research Findings
5.2 Achievements of the Study
5.3 Contributions to the Field
5.4 Limitations and Recommendations for Future Research
5.5 Conclusion
Thesis Overview:
The use of phase change materials (PCMs) for thermal management of electronic devices has gained significant attention in recent years. This thesis focuses on the computational modeling of heat transfer in PCMs to optimize thermal management in electronic systems. The literature review highlights the importance of thermal management in electronics, the benefits of using PCMs, and the challenges in modeling heat transfer in PCMs. The research methodology outlines the approach taken to study the heat transfer process in a PCM material, including the selection of material, modeling techniques, and validation methods. The discussion of findings presents an analysis of heat transfer in the PCM, the impact of material properties on thermal management, and future research directions. The conclusion summarizes the key findings, contributions to the field, and recommendations for future research in the area of computational modeling of heat transfer in PCMs for thermal management of electronics.
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